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Every year Samsung regularly advances its chip fabrication capabilities. The brand is one of the world’s largest semiconductor chipmakers. Now it has expanded its partnership with Dutch semiconductor equipment giant ASML to produce more advanced logic and memory chips for the AI era. It will use High-NA EUV machines for mass production of DRAM chips in 2028.
However, this collaboration entails Samsung using ASML’s High-NA EUV (Extreme Ultraviolet) lithography equipment. Also Samsung is joining an industry initiative to adopt next-generation 12-inch photomasks.
Furthermore, the shift will boost fab (chip fabrication plant) productivity, lower chipmaking costs, and remove stitching constraints on the most advanced chip manufacturing nodes. Also, the brand will work closely with industry partners to develop the necessary mask technologies and infrastructure to support this transition.
Moreover, the announcement from Samsung has revealed its plans to use High-NA EUV machines for high-volume DRAM manufacturing by 2028. It marks the industry’s first use of High-NA EUV for DRAM production, thereby extending the memory scaling roadmap and simplifying manufacturing steps as well as improving production efficiency.
According to the Vice Chairman and CEO of Samsung Electronics, Young Hyun Jun, the AI era demands innovation across the whole chip value chain. Also, the expanded partnership with ASML establishes the foundation for Samsung’s future leadership in AI hardware and semiconductor manufacturing.
Source 1, source 2.